Lenovo · ThinkAgile

Lenovo ThinkAgile MX630 V4

Lenovo ThinkAgile MX630 V4.

Новое1UV42 CPU
Lenovo ThinkAgile MX630 V4 — вид спереди
5 890 000 ₸ с НДС
Артикул: EQ-LENOVO-THINKAGILE-MX630-V4
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Характеристики

Возможности платформы, не установленная комплектация. Совместимость и состав поставки подтвердим при расчёте.

Вендор
Lenovo
Модель
ThinkAgile MX630 V4
Линейка
ThinkAgile
Поколение
V4
Формфактор
1U
Процессоров, до
2
Платформа CPU
Intel Xeon
Доступные состояния
Новое
Артикул
EQ-LENOVO-THINKAGILE-MX630-V4
Подробные характеристики
Поддержка процессоров
Two Intel Xeon 6700P-series or 6500P-series processors (formerly codenamed "Granite Rapids-SP"). Supports processors up to 86 cores and 172 threads, core speeds of up to 4.0 GHz, and TDP ratings of up to 350 W.
Память и заполнение DIMM
32 DIMM slots with two processors (16 DIMM slots per processor). Each processor has 8 memory channels, with 2 DIMMs per channel (DPC). Lenovo TruDDR5 RDIMMs are supported. DIMMs operate at up to 6400 MHz at 1 DPC and up to 5200 MHz at 2 DPC. Intel Xeon 6500P and 6700P-series processors also support MRDIMMs up to 8000 MHz at 1 DPC.
Накопители и варианты корзин
Up to 12x 2.5-inch hot-swap drive bays plus M.2 drives: Front bays can be one of the following: 10x 2.5-inch hot-swap NVMe drive bays 10x 2.5-inch hot-swap: AnyBay drive bays (supports NVMe, SAS, or SATA) 10x 2.5-inch hot-swap: 6x SAS/SATA + 4x AnyBay 10x 2.5-inch hot-swap: 6x SAS/SATA + 4x NVMe 10x 2.5-inch hot-swap: 6x SAS/SATA + 2x AnyBay + 2x NVMe 8x 2.5-inch hot-swap NVMe drive bays 8x 2.5-inch hot-swap SAS/SATA 16x E3.S 1T NVMe hot-swap drives 8x E3.S 2T NVMe hot-swap drives Rear can be one of the following: 2x 2.5-inch hot-swap NVMe bays 2x 2.5-inch hot-swap SAS/SATA bays M.2 support, for OS boot and drive storage support: 2x front or rear hot-swap M.2 drive bays, or Internal M.2 module supporting up to two M.2 drives See Supported drive bay combinations for details. AnyBay bays support SAS, SATA or NVMe drives. NVMe bays only support NVMe drives.
Расширение PCIe
Up to 3x slots, all at the rear, plus 2 OCP slots. All slots are PCIe 5.0. Four choices for rear-access slots: 3x PCIe 5.0 x16 low-profile slots 2x PCIe 5.0 x16 full-height half-length slots 1x PCIe 5.0 x16 full-height half-length slot + 1x PCIe 5.0 x16 low-profile slot (also supports 2x rear hot-swap M.2 drive bays) 1x PCIe 5.0 x16 low-profile slot (also supports 2x rear 2.5-inch drive bays) All configurations include at the rear of the server: 2x OCP slots with PCIe 5.0 x16 or x8 connection For 2.5-inch front drive configurations, the server supports the installation of a CFF RAID adapter or HBA in a dedicated area that does not consume any of the rear PCIe slots.
Сетевые интерфейсы
Two dedicated OCP 3.0 SFF slots with a PCIe 5.0 host interface, either x8 or x16. Support a variety of 2-port and 4-port adapters with 1, 10, 25 and 100 GbE network connectivity. One port of each installed OCP adapter can optionally be shared with the XClarity Controller (XCC3) management processor for Wake-on-LAN and NC-SI support.
Управление
Operator panel with status LEDs. Optional External Diagnostics Handset with LCD display. Clarity Controller 3 (XCC3) embedded management based on the ASPEED AST2600 baseboard management controller (BMC), XClarity Administrator centralized infrastructure delivery, XClarity Integrator plugins, and XClarity Energy Manager centralized server power management. Optional XCC3 Premier to enable remote control functions and other features.
Блоки питания
Up to two hot-swap redundant AC power supplies, 80 PLUS Platinum or 80 PLUS Titanium certification. 800W, 1300W, 2000W AC options. All AC power supplies support 230V power; some also support 115V input supply. In China only, all power supply options support 240 V DC. Support for HVDC and -48V DC power supply options.
Размеры
Width: 440 mm (17.3 in.), height: 43 mm (1.7 in.), depth: 788 mm (31 in.)
Разъёмов DIMM, до
32

Описание платформы

Lenovo ThinkAgile MX630 V4. 1U, до 2 CPU. Варианты накопителей и состав поставки зависят от заводского исполнения.

Конфигурацию собираем под задачу: процессоры, память, диски и сеть подбираем отдельно. Напишите, что нужно — предложим вариант и назовём цену в течение рабочего дня.